Hardware Implementation of Isolated Input Series Output Parallel (I-ISOP) DC-DC Converter

Multimodule isolated converters incorporating excellent features of galvanic isolation, bidirectional power flow, and simple control are widely adopted in medium-voltage (MV)  high-power dc-dc applications. However, the converter size and dc-link capacitor voltage balancing are significant conc

Project Title

Hardware Implementation of Isolated Input Series Output Parallel (I-ISOP) DC-DC Converter

Project Area of Specialization

Electrical/Electronic Engineering

Project Summary

Multimodule isolated converters incorporating excellent features of galvanic isolation, bidirectional power flow, and simple control are widely adopted in medium-voltage (MV)  high-power dc-dc applications. However, the converter size and dc-link capacitor voltage balancing are significant concerns in galvanically isolated cascaded dc-dc converters. For high power applications, input series output parallel (ISOP) DC-DC converters becomes more popular than the other topologies. In conventional H-bridge converter topologies, high voltage Silicon Carbide (SiC) switches are employed, however, these switches are expensive, bulky, and bear high losses. These SiC switches can be replaced by low-power low voltage SiC switches in cascaded topologies, which will ultimately reduce the cost, bulkiness, and losses of the converter. 

Project Objectives

The small power rating switching devices are utilized in the ISOP topology to replace the high voltage, high power rating silicon carbide (SiC) devices. The footprint of the converter will be reduced; thus, the designed converter may be easily installed in various smart applications including Data servers, EV chargers, etc. The modularity feature of the ISOP converter will ensure high reliability.

Project Implementation Method

The proposed converter will be initially simulated in Proteus suite software to validate the desired results. In software implementation, Arduino UNO will be utilized to produce the PWM signal, then the gate signal will be fed to Gate Drive Circuit to energize the FETs installed in the H-bridge. Electrolytic flying capacitor are used at the high voltage side to equally distribute the input high voltage among the H-bridge cascaded modules. Once the project is successfully simulated in Proteus, then hardware implementation of the proposed design will be carried out.

In hardware implementation, a power PCB will be designed in Altium PCB design software. The printed PCB will be tested to achieve the desired results. Finally, a reduced footprint of the converter’s PCB will be designed to reduce the footprint of the converter. The reduced footprint will be suitable to install in a portable EV charger application.

Benefits of the Project

As our project objective is to replace the expensive high power rating and bulky SiC switches by low power SiC switches arranged in a ISOP topologies which will reduce the footprint of converter and can be easily install in high voltage high power applications. Second the modularity feature of ISOP converter will be upgrade so in case of any hardware issue we will just change the specific damaged module instead of changing the whole converter.

The footprint of the converter will be reduced; thus, the designed converter may be easily installed in various smart applications including Data servers, EV chargers, etc. The converter has a significant feature of modularity, which will ensure high reliability of the system.

Technical Details of Final Deliverable

The final deliverable design i.e Design and Construction of ISOP will use 16 FETs, a six channel Gate driver for operating of FETs.Arduino UNO will generate PWM for the operation of FETs. Two Electrolytic Capacitors will be connect to the input side of ISOP in series while one Electrolytic Capacitor will be connect to the ouput side of ISOP in paraller,two Transformers will connect to the input and output side of ISOP.Resonance Capacitor will connect in series with Inductor on both side of the Transformers.We will connect Resistor as a load to the output side of the ISOP in paraller and Oscilloscope to observe the Results.

Final Deliverable of the Project

Hardware System

Core Industry

Energy

Other Industries

Core Technology

Others

Other Technologies

Sustainable Development Goals

Good Health and Well-Being for People, Quality Education, Decent Work and Economic Growth, Industry, Innovation and Infrastructure, Climate Action, Peace and Justice Strong Institutions, Partnerships to achieve the Goal

Required Resources

If you need this project, please contact me on contact@adikhanofficial.com