Design of a Fault Tolerant On Board Computer for CubeSat

The project includes the design and development of a prototype On-board Computer (OBC) module for a CubeSat. The operations in a satellite such as CubeSat are autonomous and depend upon the exchange of information between different interconnected subsystems. The OBC designed around a microcontroller

2025-06-28 16:31:56 - Adil Khan

Project Title

Design of a Fault Tolerant On Board Computer for CubeSat

Project Area of Specialization Electrical/Electronic EngineeringProject Summary

The project includes the design and development of a prototype On-board Computer (OBC) module for a CubeSat. The operations in a satellite such as CubeSat are autonomous and depend upon the exchange of information between different interconnected subsystems. The OBC designed around a microcontroller and other memories and interfaces helps achieving this task. It performs the required computations, telemetry and health checks and hence act as a satellite’s brain.

Due to the harsh environment and radiation in space, the operation of electronics in satellites such as on OBC is greatly affected. The OBC performs different computations and stores different kinds of data and programs in its memory units. Therefore any damage to the OBC itself or to the stored data can cause the failure in the proper functioning of the satellite. The most common effects are the Single Event Effects (SEEs) which are caused by the highly energized particles in the space striking the satellite’s body. These include the SEUs (Single Event Upsets) causing bit flips in the stored data in memories and the SEL (Single Event Latch Up) causing the excessive current flow through the affected device damaging it permanently. Therefore some mechanism should be developed to counter these effects of space environment in order to increase the reliability of the overall system which is the most important constraint in designing space systems.

Therefore the goal of the project is to make a fault tolerant hardware design of the OBC. This is achieved by implementing the mechanisms for latch up prevention and Error Detection and Correction (EDAC) scheme for counteracting the SEUs. Further the project also includes the development of a test bench for the verification of the systems designed in the OBC to induce fault tolerance and increase system reliability.

The board will be designed keeping in view the CubeSat standards and specifications required in the small satellite development project of Institute of Space Technology.

Project Objectives Project Implementation Method Benefits of the Project

The major advantage of the CubeSat technology is its affordability and a much simpler design process for access to space as compared to conventional satellites. CubeSats have become popular worldwide due to the advantages they provide at a much lower cost in the fields of disaster management, earth observation, communication, etc. For a country like Pakistan which is one of the most susceptible countries to climate change, the desired goals to counter climate change can be achieved by use of CubeSats to monitor the glacier melting, deforestation, flooding, etc. Moreover being an agriculture based economy, Pakistan can greatly improve its crops’ yield through the use of CubeSat satellites in monitoring the crops and soil characteristics and ultimately contributing towards the country’s economy and uplifting the living standard of people.

Therefore the design and development process of different CubeSat subsystems such as this On-board Computer (OBC) can help in increasing the satellite developing capabilities of the students and institutes involved in development of such projects. This will ultimately result in the development of indigenous CubeSats for Pakistan.

Technical Details of Final Deliverable

Final deliverable would be a developed PCB hardware prototype of an On Board Computer along with its test bench implemented on a Computer. The board will provide the capability of latch up prevention in SRAMs and single error correction to counter SEUs through the EDAC scheme implemented. The board will provide all the required interfaces for the controlling and handling of data and commands for different CubeSat subsystem modules.

Final Deliverable of the Project HW/SW integrated systemCore Industry OthersOther IndustriesCore Technology OthersOther TechnologiesSustainable Development Goals Sustainable Cities and Communities, Climate Action, Life on Land, Partnerships to achieve the GoalRequired Resources
Item Name Type No. of Units Per Unit Cost (in Rs) Total (in Rs)
Total in (Rs) 79013
EFM32GG280F1024G-E-QFP100R (IC MCU 32BIT 1MB FLASH 100LQFP) Equipment411104440
AT28C256-15SU (IC EEPROM 256K PARALLEL 28SOIC) Equipment214102820
STWD100NYWY3F (IC SUPERVISOR 1 CHANNEL SOT23-5) Equipment4130520
NX5032GA-32.000000MHZ-LN-CD-1 (CRYSTAL 32.0000MHZ 8PF SMD) Equipment4100400
ABS10-32.768KHZ-1-T (CRYSTAL 32.7680KHZ 12.5PF SMD) Equipment4155620
TPS76733QD (IC REG LINEAR 3.3V 1A 8SOIC) Equipment35651695
INA139NA/3K (IC CURRENT MONITOR 0.5% SOT23-5) Equipment82411928
SN74LVCH16373ADGGR (IC TRANSP LATCH TRI-ST 48-TSSOP) Equipment4185740
SN74CBT16245CDGGR (IC SWITCH BUS 16BIT FET 48-TSSOP) Equipment72401680
5025700893 (CONN MICRO SD CARD PUSH-PUSH R/A) Equipment1615615
FPF2123 (IC PWR SWITCH P-CHAN 1:1 SOT23-5) Equipment590450
ESQ-126-39-G-D (CONN SOCKET 52POS 0.1 GOLD PCB) Equipment218003600
M20-7910342R (CONN RCPT 3POS 0.1 GOLD SMD R/A) Equipment3120360
M22-6540642R (CONN RCPT 6P 0.079 GOLD SMD R/A) Equipment3170510
ADA4851-4YRUZ-RL7 (IC OPAMP VFB 4 CIRCUIT 14TSSOP) Equipment35101530
TLV75712PDBVR (IC REG LINEAR 1.2V 1A SOT23-5) Equipment3125375
TLV75725PDBVR (IC REG 2.5V LINEAR 1A) Equipment3120360
S29AL008J70TFI020 (IC FLASH 8M PARALLEL 48TSOP) Equipment3255765
CY62136EV30LL-45ZSXI (IC SRAM 2M PARALLEL 44TSOP II) Equipment45802320
ASE-48.000MHZ-LC-T (XTAL OSC XO 48.0000MHZ CMOS SMD) Equipment1185185
Spartan-3E Xilinx FPGA XC3S500E Development Board Equipment193009300
Xilinx Spartan-3E IC (XC3S500E) Equipment249009800
PCB Fabrication Equipment3800024000
PCB Assembly Miscellaneous 150005000
Printing and stationary costs Miscellaneous 150005000

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